Oven and load preparation
Solidus–liquidus binary diagram
Ideal Cu–Ni equilibrium solution model, not a calibrated experimental diagram. The curves are phase boundaries; the point follows the actual composition and temperature of the simulation.
Melting and cooling: T as a function of time
Local adaptive engine · online learning
Recursive regression of the thermal response, trained on this campaign, excluding solid–liquid mixture. No remote AI model or industrial calibration. Each addition of metal resets the identification because the inertia changes.
Balance sheets
Log
Scientific hypotheses and references
Ideal activities, solid α / liquid L balance, instant mixing. No segregation, oxidation, evaporation or overcooling. Mass lever rule. Latent heat and sensible heat preserved in a load model + equivalent thermal capacity of the crucible of 40 kJ/K. Assumed electrical efficiency: 85%. Educational interlock: heating cut off from 1700°C to stay within model range. Specific heat changes and enthalpy of mixing effects are neglected.
Ideal chemical potentials with Tfusion Cu = 1357.77 K and Ni = 1728 K; ΔHfusion Cu = 13.05 kJ/mol, Ni = 17.48 kJ/mol. The results deviate from the actual Cu–Ni diagram.
Princeton · domains of the Cu–Ni system · NIST JANAF · liquid nickel · NIST · copper